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Job Title: Electronics Packaging Lead Engineer

Qualification: B.Tech/MTech (Mech/Electronics/ENTC )

Experience: 3-8 Years

Job Post Date: 25/03/2022

Job Expiry Date: 23/05/2022

Location: Pune




Job Description:

  • Should have experience in enclosure development using 3D/2D tool (CATIA)
  • Experience in enclosure development considering IP requirement ( IP54, IP67……)
  • Good experience in heatsink & busbar design
  • Know-how of electronics components packaging (MOSFET, IGBT, Busbar etc.) inside of enclosure for better thermal performance
  • Good knowledge of thermal management, heat flow/airflow.
Apply now

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